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Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is a leading semiconductor company with rapid growing business in the AI accelerator and networking chips. We are hiring a talent to develop and enable advanced packaging technology to integrate memory dies and SoC dies into one package for AI related products. Key job scope includes - packaging technology roadmap future product needs for 3-5 years - support development of key components (HBM, iVR, Si Cap) for advanced packaging - manage reliability test to qualify new technology - lead yield improvement activities for new technology ramp-up The job requires intensive experience in related area - such as 2.5D/3D and HBM technology development and reliability/yield improvements. Project management and team work skills are required. Strength in technology innovation, development, and enablement are key factors to consider. A M.S. degree in related engineering field with at least 10 years (post degree) of direct experience (or 7 years with a Ph.D. degree) is required. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.
Here's how to pick the right one and stand out in your application.
144.883Jobs
31.687IN
81%EN
That number is real. WorkMundi's database shows 144,883 open engineer roles across the world. India has the most with 31,687 jobs, followed by the United States with 30,084. If you just finished reading one job ad and felt paralyzed by choice, you're not alone—but this scale is actually an advantage. It means you can afford to be selective.
Start by geography and language. The majority of engineer ads—117,837 of them—have the job posting text written in English. Use that as one filter, but remember: the ad text language tells you nothing about whether the role actually requires you to speak English day-to-day. Read the job description carefully. Then check which countries have the volume you're targeting. Singapore, Poland, and Australia round out the top five after India and the US.
Next, learn who's hiring. Accenture has posted 2,801 engineer roles. andurilindustries, speechify, and jobgether are also actively recruiting. If you're applying to one of these names, research their hiring patterns and interview style before you apply. That homework pays off.
When you interview, expect the question every engineer hears: 'Tell me about a time you had to debug a problem that wasn't in your job description.' Have a specific story ready—not a general one. Name the tools, the deadline pressure, and what you learned. Hiring managers listen for whether you see problem-solving as part of the role itself, not a favour.