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Assembly Process Engineering Manager- Semiconductor Packaging Location: Ahmedabad, Gujarat, India Work Mode: Onsite Employment Type: Full-Time Experience: 12 -18 Years Industry: Semiconductor / ATMP / OSAT / IC Packaging Role Overview We are looking for an Assembly Process Engineering Manager to lead semiconductor packaging-process engineering in a high-volume ATMP/OSAT manufacturing environment. The role will own process development, qualification, production ramp-up, process stability, yield improvement and engineering-team performance. The position requires hands-on expertise in die preparation, die attach, wire bonding, molding, marking and package singulation, along with proven experience leading cross-functional engineering programs. Key Responsibilities Lead the assembly process-engineering team supporting high-volume semiconductor packaging operations.Own process performance across wafer preparation, die attach, wire bonding, molding, marking and singulation.Develop and optimize process recipes, process windows, control plans and operating procedures.Lead process characterization, equipment qualification and production release activities.Drive new-product introduction, package qualification and transfer into volume manufacturing.Execute DOE, SPC and process-capability studies to improve yield and process stability.Monitor defect trends, scrap, rework, process excursions and critical manufacturing parameters.Lead root-cause analysis and corrective actions for process, material, equipment and package-quality issues.Collaborate with equipment engineering to improve equipment capability, uptime and repeatability.Work with product engineering, quality, reliability and manufacturing teams to meet production targets.Qualify new assembly materials, consumables, suppliers and process changes.Develop PFMEA, control plans, OCAPs, 8D reports and CAPA actions.Reduce process variation, manufacturing cycle time, scrap and cost of poor quality.Establish Best Known Methods and ensure consistent implementation across production lines.Build technical capability through recruitment, training, mentoring and succession planning.Support internal, customer and quality-system audits related to assembly processes.Required Qualifications Bachelor s or Master s degree in Electronics, Electrical, Mechanical, Materials, Chemical, Manufacturing Engineering or a related discipline.12 -18 years of experience in semiconductor assembly, IC packaging, ATMP, OSAT or IDM backend manufacturing.At least 4- 6 years of experience managing process engineers or leading major assembly-engineering programs.Strong hands-on experience in multiple semiconductor packaging processes.Experience transferring new products and processes into high-volume manufacturing.Proven success in yield improvement, defect reduction and process-capability enhancement.Experience working with manufacturing, equipment, product, quality, reliability and supplier teams.Ability to support production escalations in a 24 x7 manufacturing environment.Technical Skills Assembly and Packaging Processes Wafer mounting, backgrinding and dicingDie preparation and die sortingDie attach and die bondingWire bondingFlip-chip assemblyUnderfill and encapsulationTransfer or compression moldingTrim and formLaser markingPackage singulationPackage inspection and handlingProcess Engineering Process development and characterizationProcess-window optimizationEquipment and process qualificationDesign of ExperimentsStatistical Process ControlProcess Capability AnalysisMeasurement System AnalysisDefect and variation reductionRecipe and parameter managementBest Known Method developmentQuality and Problem-Solving PFMEAControl plansOCAP8D problem-solvingRoot-cause analysisCAPAFault Tree AnalysisProcess excursion managementChange-point controlContinuous improvementPackaging Materials Die-attach adhesives and filmsBond wires and bonding materialsMold compoundsSubstrates and leadframesUnderfill materialsSolder and interconnect materialsMaterial qualificationSupplier process qualification #LI-SD1 .
Here's how to pick the right one and stand out in your application.
144.883Jobs
31.687IN
81%EN
That number is real. WorkMundi's database shows 144,883 open engineer roles across the world. India has the most with 31,687 jobs, followed by the United States with 30,084. If you just finished reading one job ad and felt paralyzed by choice, you're not alone—but this scale is actually an advantage. It means you can afford to be selective.
Start by geography and language. The majority of engineer ads—117,837 of them—have the job posting text written in English. Use that as one filter, but remember: the ad text language tells you nothing about whether the role actually requires you to speak English day-to-day. Read the job description carefully. Then check which countries have the volume you're targeting. Singapore, Poland, and Australia round out the top five after India and the US.
Next, learn who's hiring. Accenture has posted 2,801 engineer roles. andurilindustries, speechify, and jobgether are also actively recruiting. If you're applying to one of these names, research their hiring patterns and interview style before you apply. That homework pays off.
When you interview, expect the question every engineer hears: 'Tell me about a time you had to debug a problem that wasn't in your job description.' Have a specific story ready—not a general one. Name the tools, the deadline pressure, and what you learned. Hiring managers listen for whether you see problem-solving as part of the role itself, not a favour.